Teledyne FLIR, part of Teledyne Technologies Incorporated, announced the Boson+ with thermal sensitivity of 20 millikelvin (mK) or less. It shares the SWaP of the widely deployed and real-world-proven Boson thermal camera module. With identical mechanical, electrical, and optical interfaces, the Boson+ is a drop-in upgrade that also includes updated image processing to deliver enhanced sharpness and contrast for defense and commercial applications.
Made in the USA, the Boson+ includes a redesigned 640 x 512 resolution, 12-micron pixel pitch detector with a noise equivalent differential temperature (NEDT) of 20 mK or less which offers significantly enhanced detection, recognition, and identification (DRI) performance. Improved video latency enhances tracking, seeker performance, and decision support.
The shared Boson series interface and access to the US-based Teledyne FLIR Technical Services team reduce development risk and shorten time to market. Truly designed for integrators, the Boson+ is available with a variety of lens options, comprehensive product documentation, an easy-to-use SDK, and a user-friendly GUI. Boson+ is dual use and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a.
The Teledyne FLIR Boson+ is available for purchase globally from Teledyne FLIR and its authorized dealers.
Teledyne FLIR https://www.flir.com/bosonplus
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